Self-crosslinking, thermosetting CED binder
Chemistry - Epoxy resins
Technology - Waterborne resins
Application - Direct to Metal
Final Product - Improved corrosion resistance, tin-free technology, bismuth catalyzed.
Variation in film thickness possible 20-45 µm.
Dynamic Viscosity (100 1/s; 23 °C) - 200-300 MPa. S
Density (Liquids) - approximately 1.02-1.06 (20 °C) g/cm³
Self-crosslinking, thermosetting CED binder
Chemistry - Epoxy resins
Technology - Waterborne resins
Application - Direct to Metal
Final Product - Improved corrosion resistance, tin free technology, bismuth catalyzed.
Variation in film thickness possible 20-45 µm.
Dynamic Viscosity (100 1/s; 23 °C) - 200-300 mPa.s
Density (Liquids) - 1,02-1.06 approx. (20 °C) g/cm³]