Home Easy Sourcing All Sourcing Requests Electrical & Electronics Diamond Wire Cutting Machine for Semiconductor Wafers

Diamond Wire Cutting Machine for Semiconductor Wafers

  • Date Posted: 2025-04-15 03:05 From English Site
  • Valid to:2025-07-12
  • Purchase Quantity: 1 Piece(s)
  • Sourcing Request From:Request From: India
Quote Left: 4
Product Description Buyer Business Info.
I' M seeking a machine that slices Silicon Carbide (SiC) and Gallium Nitride (GaN) ingots into wafers for semiconductor applications.

Quotation Record 6 supplier(s) have provided quotations. Only 4 quoting chance(s) left!

Company Name Business Type Location Quote Time
Yu****** Manufacturer/Factory & Trading Company Tangshan, Hebei 2025-05-02 09:44
Wu****** Manufacturer/Factory Wuhan, Hubei 2025-04-25 15:23
PU****** Manufacturer/Factory,Trading Company Putian, Fujian 2025-04-17 10:30
Sh****** Manufacturer/Factory Shanghai, Shanghai 2025-04-17 10:19
Zh****** Manufacturer/Factory & Trading Company Zhengzhou, Henan 2025-04-17 07:41
Ha****** Manufacturer/Factory & Trading Company Hangzhou, Zhejiang 2025-04-15 11:43