Diamond Wire Cutting Machine for Semiconductor Wafers - Easy Sourcing on Made-in-China.com

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Home Easy Sourcing All Sourcing Requests Electrical & Electronics Diamond Wire Cutting Machine for Semiconductor Wafers

Diamond Wire Cutting Machine for Semiconductor Wafers

Purchase Quantity1 Piece(s)
Date Posted2025-04-15
Quotes Recived4
Sourcing Request From India
Valid to2025-07-12

Product Description

I' M seeking a machine that slices Silicon Carbide (SiC) and Gallium Nitride (GaN) ingots into wafers for semiconductor applications.

4 Audited Suppliers have quoted

Fujian_Putian, Fujian
2025-04-17
PU******

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Energy Saving and Emission Reduction
Shanghai_Shanghai, Shanghai
2025-04-17
Sh******

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Energy Saving and Emission Reduction
Henan_Zhengzhou, Henan
2025-04-17
Zh******

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Energy Saving and Emission Reduction
Zhejiang_Hangzhou, Zhejiang
2025-04-15
Ha******

Audit Content:

Foreign Trade Capacity

Product Research & Development Capacity

Management System and Product Certification

Production Capacity & Quality Control

Financial Position

Financial

Working Environment

Photos

Industry Information

Energy Saving and Emission Reduction